Microscope image of electromigration-induced hillock and void
Descrição
Electromigration - an overview
Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library
Materials, Free Full-Text
Electromigration Encyclopedia MDPI
The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures
In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics
A Review of the Study on the Electromigration and Power Electronics
Microscope image of electromigration-induced hillock and void
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