Microscope image of electromigration-induced hillock and void
Descrição
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Electromigration - an overview
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Mitigation of Electromigration in Metal Interconnects via Hexagonal Boron Nitride as an Ångström‐Thin Passivation Layer - Jeong - 2021 - Advanced Electronic Materials - Wiley Online Library
![Microscope image of electromigration-induced hillock and void](https://www.mdpi.com/materials/materials-14-06394/article_deploy/html/images/materials-14-06394-g008-550.jpg)
Materials, Free Full-Text
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Electromigration Encyclopedia MDPI
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The electromigration effect revisited: non-uniform local tensile stress-driven diffusion
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PDF) In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures
In-Situ Observation and Quantitative Analysis of Electromigration Void Dynamics
![Microscope image of electromigration-induced hillock and void](https://html.scirp.org/file/2-1520073x9.png)
A Review of the Study on the Electromigration and Power Electronics
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Microscope image of electromigration-induced hillock and void
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